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NTTFS4824N
Power MOSFET
30 V, 69 A, Single N ? Channel, m 8FL
Features
? Small Footprint (3.3 x 3.3 mm) for Compact Design
? Low R DS(on) to Minimize Conduction Losses
? Low Capacitance to Minimize Driver Losses
? These Devices are Pb ? Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
? DC ? DC Converters
? Low Side Switching
MAXIMUM RATINGS (T J = 25 ° C unless otherwise stated)
V (BR)DSS
30 V
http://onsemi.com
R DS(on) MAX
5.0 m W @ 10 V
7.5 m W @ 4.5 V
N ? Channel MOSFET
D (5 ? 8)
I D MAX
69 A
Parameter
Drain ? to ? Source Voltage
Symbol
V DSS
Value
30
Unit
V
Gate ? to ? Source Voltage
Continuous Drain
Current R q JA (Note 1)
Power Dissipation R q JA
(Note 1)
Continuous Drain
Current R q JA ≤ 10 s
(Note 1)
Power Dissipation
R q JA ≤ 10 s (Note 1)
Continuous Drain
Current R q JA (Note 2)
Steady
State
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
T C = 25 ° C
T C = 85 ° C
V GS
I D
P D
I D
P D
I D
± 20
14.9
10.8
2.2
20.6
14.9
4.1
8.3
6.0
V
A
W
A
W
A
G (4)
1
WDFN8
( m 8FL)
CASE 511AB
FLAT LEAD
4824
S (1,2,3)
MARKING DIAGRAM
1
S D
S 4824 D
S AYWW G D
G G D
= Specific Device Code
Power Dissipation
R q JA (Note 2)
Continuous Drain
Current R q JC (Note 1)
Power Dissipation
R q JC (Note 1)
T C = 25 ° C
T C = 25 ° C
T C = 85 ° C
T C = 25 ° C
P D
I D
P D
0.66
69
50
46.3
W
A
W
A = Assembly Location
Y = Year
WW = Work Week
G = Pb ? Free Package
(Note: Microdot may be in either location)
Pulsed Drain Current T A = 25 ° C, t p = 10 m s
Operating Junction and Storage Temperature
I DM
T J ,
T stg
207
? 55 to
+150
A
° C
ORDERING INFORMATION
Device Package Shipping ?
Source Current (Body Diode)
I S
46.3
A
NTTFS4824NTAG
WDFN8
1500/Tape & Reel
Drain to Source dV/dt
Single Pulse Drain ? to ? Source Avalanche Energy
(T J = 25 ° C, V DD = 50 V, V GS = 10 V,
I L = 38 A pk , L = 0.1 mH, R G = 25 W )
Lead Temperature for Soldering Purposes
(1/8 ″ from case for 10 s)
dV/dt
E AS
T L
6.0
72
260
V/ns
mJ
° C
(Pb ? Free)
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface ? mounted on FR4 board using 1 sq ? in pad, 1 oz Cu.
2. Surface ? mounted on FR4 board using the minimum recommended pad size.
? Semiconductor Components Industries, LLC, 2013
September, 2013 ? Rev. 5
1
Publication Order Number:
NTTFS4824N/D
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